المتجر متاح الآن

نبني أجهزة Workstation AI للمواقع ووكلاء الذكاء الاصطناعي وتدريب LLM — اضبطوها واشتروها عبر الإنترنت.

احصل على أسعار التجار
منتجات الذكاء الاصطناعي
مختبرات الذكاء الاصطناعيوكلاء OpenAIوكلاء ClaudeGrok Botنظام CRM الأصلي من Workstation AIالتسويقجميع المنتجات
حلول الذكاء الاصطناعي
الذكاء الاصطناعي التطبيقيوكلاء الذكاء الاصطناعيالذكاء الاصطناعي التوليديأتمتة بالذكاء الاصطناعيرفع مهارات الذكاء الاصطناعيحزم الذكاء الاصطناعي للمنشآت الصغيرة والمتوسطةمختبر الذكاء الاصطناعي للمؤسساتمحطات عمل الذكاء الاصطناعيعتاد وبرمجيات NVIDIAالحوسبة المسرّعة من NVIDIAالذكاء الاصطناعي الخاصسحابة GPU خاصةعناقيد GPUالذكاء الاصطناعي الطرفيالذكاء الاصطناعي حسب القطاع
خدمات الذكاء الاصطناعي
تحديث المنصاتالهندسة الرقميةأسس البيانات والذكاء الاصطناعيعمليات مستقلةاستشارات الذكاء الاصطناعيأتمتة DevOpsالأمن السيبرانيتطوير البرمجياتبناء الوكلاءإعداد MLOpsتأجير وحدات GPUسحابة GPU خاصة
من نحن
الشركةقصتناالشركاءقصص العملاء
مراكز بيانات الذكاء الاصطناعي
مراكز بيانات الذكاء الاصطناعيسحابة GPU خاصةعناقيد GPUتأجير وحدات GPU
رؤى الذكاء الاصطناعيسلسلة Jevمختبر المعاييراختيار النماذج
ملاحظات تقنية
التوثيق
نظام LinuxUbuntuRed Hat Enterprise LinuxSUSE LinuxAlpine LinuxDebian, Rocky & AlmaLinux
منصات الذكاء الاصطناعي السحابيةAWS & Amazon BedrockGoogle Cloud & Vertex AIMicrosoft Azure & AI Foundryسحابات وأسواق وحدات GPU
مراكز بيانات الذكاء الاصطناعي الخاصةلمكاتب المحاماةلشركات المحاسبةالمنصات المحليةسحابة مؤمنة بالكامل
الأدواتRing PromoterJobshout
الأخبار
المدونة
اتصل بناتسجيل الدخول

محطات عمل الذكاء الاصطناعي وبرمجيات الوكلاء المتعددة والبنية التحتية لوحدات GPU وحلول الوكلاء الأذكياء للشركات الحديثة.

اتصل بنا

حلول الذكاء الاصطناعي

الذكاء الاصطناعي التطبيقيوكلاء الذكاء الاصطناعيالذكاء الاصطناعي التوليديأتمتة بالذكاء الاصطناعيرفع مهارات الذكاء الاصطناعيحزم الذكاء الاصطناعي للمنشآت الصغيرة والمتوسطةمختبر الذكاء الاصطناعي للمؤسساتالذكاء الاصطناعي حسب القطاع

المنتجات

جميع المنتجاتWorkstation AI native CRM و ERPالتسويقوكلاء OpenAIRing PromoterJobshout

الشركة

من نحنالشركةمراكز بيانات الذكاء الاصطناعيلماذا Workstationالشركاءقصص العملاءالأسعاراتصلTenthMatrix

الموارد

رؤى الذكاء الاصطناعيملاحظات تقنيةالتوثيقنظام Linuxمنصات الذكاء الاصطناعي السحابيةمراكز بيانات الذكاء الاصطناعي الخاصةالمدونةبحثخريطة الموقع
المقر الرئيسي في المملكة المتحدة
77-79 Marlowes, Hemel Hempstead HP1 1LFالاتجاهات - اسلك المخرج 20 من الطريق M25 في لندن الخارجيةرقم الشركة: 11641870الاثنين - الجمعة: 9:00 ص - 6:00 م بتوقيت GMT
+44 7515 356 146
مكتب بلجيكا
Workstation SRL, Rue Vanderkindere 34, 1180 Uccle, BrusselsBE 0751.518.683الاثنين - الجمعة: 9:00 ص - 6:00 م بتوقيت CET
+32 492 45 67 46
مكتب الهند
#159 Sector 9, Pocket 1, DDA Flats, 110077 Dwarka, New Delhi
+91 98881 98841
مكتب تايوان
3F, No. 2-4, Aisi Rd., Ren'ai Dist., Keelung City 200, Taiwan基隆市仁愛區愛四路2之4號3樓الاثنين - الجمعة: 9:00 ص - 6:00 م بتوقيت تايوان (GMT+8)
+886 926 892 701

© 2026 Workstation AI. جميع الحقوق محفوظة.

الخصوصيةحذف البياناتملفات تعريف الارتباطشروط الخدمةخريطة الموقع الإلكتروني

NVIDIA, the NVIDIA logo, RTX, RTX PRO, Blackwell, CUDA, NVLink, MGX, Omniverse, Spectrum-X, Quantum, BlueField, DGX and HGX are trademarks and/or registered trademarks of NVIDIA Corporation in the US and other countries. AMD, the AMD Arrow logo, EPYC, Instinct, Ryzen and Threadripper are trademarks of Advanced Micro Devices, Inc. Dell and PowerEdge are trademarks of Dell Inc. or its subsidiaries. Intel and Xeon are trademarks of Intel Corporation or its subsidiaries. AMAX, AceleMax and LiquidMax are trademarks of AMAX Engineering Corporation. All other product names, logos and brands are the property of their respective owners. We use them only to identify the products we describe, supply or support; their use does not mean their owners endorse us.

الرئيسية / ملاحظات تقنية / Technology
AIHardwareKubernetesArchitecture

AMD Instinct vs NVIDIA for AI Infrastructure: Evaluate, Port and Run Both (2026)

From Lisa Su's 2024 interview to Helios: the 2026 platforms layer by layer, Instinct product lines, memory arithmetic, the CUDA-to-ROCm software map, a porting workflow with commands, dual-vendor Kubernetes, fair benchmarking, a decision workflow and day-two operations

14 نوفمبر 2026Technology11 min read

A practitioner's guide for teams deciding whether AMD Instinct belongs in their AI infrastructure alongside, or instead of, NVIDIA. It starts from Lisa Su's December 2024 interview on Bloomberg's The Circuit and what AMD has shipped since, then covers the 2026 platforms layer by layer, the product lines buyers actually meet, the memory arithmetic that drives GPU counts, the CUDA-to-ROCm software map, a porting workflow with commands, running both vendors on one Kubernetes platform, a fair benchmarking method, a decision workflow and the operational checks for day two.

One Kubernetes manifest with overlays for AMD and NVIDIA nodes, beside AMD's Helios rack figures: 72 MI455X GPUs, 432 GB HBM4 per GPU, 2.9 exaflops FP4, 1.4 exaflops FP8, 31 TB HBM4, 260 TB/s scale-up and ROCm 10.

Summary. In 2026 AMD is a credible second AI platform, not a science project: its Helios rack with 72 Instinct MI455X GPUs is in volume production, five of the largest AI buyers run it, and Data Center revenue grew 97% year on year to $8.5bn in Q3 2026. NVIDIA remains far larger, with the deeper software ecosystem. For buyers the questions are practical: does your model benefit from 432 GB of memory per GPU, does your code depend on CUDA-only pieces, which vendor gives more tokens per pound on your model and serving stack, and can you get the hardware and skills in time. Most AI code runs on ROCm through PyTorch, vLLM, SGLang and Triton with little change; custom CUDA kernels and TensorRT engines are the real porting work. Running both vendors on one Kubernetes platform is straightforward and gives you leverage on price and supply.

This technote accompanies our blog post Chipping away at Nvidia's lead: Lisa Su's plan, two years on, which summarises the interview. Vendor figures below are AMD's or NVIDIA's own published claims, not independent benchmarks; we say so where it matters. Facts are as of 14 November 2026.

1. From the interview to Helios

In "AMD's CEO Wants to Chip Away at Nvidia's Lead" (Bloomberg Originals, The Circuit with Emily Chang, 6 December 2024), Lisa Su, then ten years into the job, showed the Instinct MI300 running production AI work such as GPT-4o on Microsoft Azure and Meta's Llama, called AI "the most transformational technology" of her career, and argued there were "more than enough chips for everybody" even as hyperscalers designed their own. Bloomberg's chip reporter Ian King summed up AMD's position as "a solid number two". The two years since have tested that position.

Timeline: December 2024 interview with MI300 in production; June 2025 MI350 Series launch; October 2025 OpenAI agreement for 6 gigawatts of Instinct GPUs; 2026 Helios with 72 MI455X GPUs ships in volume from Q3 and ROCm 10 is released; November 2026 Q3 Data Center revenue $8.5bn, up 97%, with first Helios racks at Anthropic, Meta, Microsoft, OpenAI and Oracle.

AMD's third-quarter 2026 release reports total revenue of $13.4bn, Data Center revenue of a record $8.5bn (up 97% year on year), volume shipments of the MI450 Series, and Anthropic, Meta, Microsoft, OpenAI and Oracle Cloud Infrastructure running workloads on the first Helios racks. It guides to about $17bn of revenue in the fourth quarter. The same release notes ROCm 10, HPE's first Helios order (for Vultr), and EuroHPC's choice of Instinct MI430X GPUs for the LUMI-AI supercomputer, which matters for European buyers looking at sovereign AI capacity.

2. The 2026 platforms, layer by layer

Layer comparison: Helios on Open Rack Wide versus Vera Rubin NVL72; MI455X with 432 GB HBM4 versus Rubin with 288 GB HBM4; UALink over Ethernet versus NVLink; Pensando AI NICs and Ultra Ethernet versus ConnectX, Spectrum-X or InfiniBand; EPYC Venice versus Vera; ROCm versus CUDA; AMD GPU Operator versus NVIDIA GPU Operator; frameworks shared.

AMD Helios (AMD's published figures)Value
GPUs per rack (one scale-up domain)72 × Instinct MI455X (CDNA 5)
Memory per GPU432 GB HBM4, up to 23.3 TB/s
Compute per GPUup to 40 PF FP4
Rack compute2.9 EF FP4, 1.4 EF FP8
Rack memory31 TB HBM4, about 1.7 PB/s aggregate
Scale-up / scale-out bandwidth260 TB/s (UALink over Ethernet) / 43 TB/s (3 × 800G NICs per GPU)
Host CPU6th Gen EPYC "Venice" (9006 Series)
Rack standardOpen Rack Wide, contributed by Meta to the Open Compute Project

AMD positions Helios directly against NVIDIA's Vera Rubin NVL72 and claims about 15% more AI compute, 50% more memory, 50% more scale-out bandwidth and up to 30% more tokens per dollar. Those are vendor claims measured by the vendor; treat them as a reason to benchmark, not as a result. The memory difference is the most structural: 432 GB per MI455X against 288 GB per Rubin GPU changes how many GPUs a large model needs (section 4).

3. The Instinct product lines you will meet

ProductMemoryWhere it fits
MI300X192 GB HBM3The 2024 generation in the interview; still common in clouds and the used market
MI325X256 GB HBM3EMemory-uplifted MI300 platform, eight-GPU servers
MI350X / MI355X288 GB HBM3E2025 generation; eight-GPU servers, air or liquid cooled; the MI455X's comparison baseline
MI430Xsee AMDHPC and sovereign AI systems; chosen for EuroHPC's LUMI-AI
MI450X / MI455X432 GB HBM4Helios rack-scale systems; frontier training and large-scale inference
MI350Psee AMDUsed in AMD's Helion reference architecture for agentic systems and in the Threadripper Halo Station workstation

Most UK organisations will meet Instinct as eight-GPU servers from Dell, HPE, Lenovo or Supermicro, or as cloud instances, rather than as full Helios racks. Helios matters to them indirectly: it is what makes ROCm a first-class target for the model and framework developers they depend on.

4. Memory arithmetic: why 432 GB changes GPU counts

Two numbers decide how many GPUs one copy of a model needs: the weights, and the key-value (KV) cache that grows with context length and concurrent users.

weights (GB)        ≈ parameters (billions) × bytes per parameter
                       FP16/BF16 = 2, FP8 = 1, FP4 = 0.5
KV cache per token  = 2 × layers × kv_heads × head_dim × bytes per value

# Example: a 70B model with 80 layers, 8 KV heads, head_dim 128, FP16 KV cache
KV per token        = 2 × 80 × 8 × 128 × 2 bytes = 327,680 bytes ≈ 0.31 MiB
KV per 32k sequence ≈ 10 GiB      KV per 128k sequence ≈ 40 GiB
Illustrative: 70B model, FP8 weights (~70 GB), FP16 KV, 10% headroom288 GB GPU432 GB GPU
Memory left for KV cache~189 GB~319 GB
Concurrent 32k-token sequences per GPU~18~30
Concurrent 128k-token sequences per GPU~4~7
~400B-parameter model at FP8 (~400 GB weights)needs 2+ GPUsfits on 1, with little room for KV

Fewer GPUs per model copy means less tensor parallelism, less inter-GPU traffic and more independent replicas from the same rack. Whether that becomes more tokens per pound depends on compute, interconnect and software efficiency too, which is why the benchmark in section 8 is the deciding step. Our GPU private cloud page has a VRAM sizer that runs the same arithmetic.

5. The software map: CUDA to ROCm

PurposeNVIDIAAMD ROCm
Programming modelCUDAHIP (CUDA-like C++; also compiles for NVIDIA)
Dense linear algebracuBLAS, cuBLASLthipBLAS, rocBLAS, hipBLASLt
Deep-learning primitivescuDNNMIOpen
Kernel templatesCUTLASSComposable Kernel
Multi-GPU collectivesNCCLRCCL (NCCL-compatible API)
Inference compilerTensorRT, TensorRT-LLMMIGraphX; most LLM serving uses vLLM or SGLang instead
Device managementnvidia-smiamd-smi
ProfilingNsight Systems / Computerocprofv3, ROCm Systems and Compute Profilers
Portable kernelsTriton (OpenAI), supported on both
Frameworks and servingPyTorch, JAX, vLLM, SGLang, Hugging Face: published builds for both

The practical rule: if your code stays at the framework level, moving to ROCm is mostly a matter of installing the ROCm build. The work concentrates in three places: custom CUDA kernels and C++ extensions, TensorRT engines, and libraries that ship CUDA-only binaries.

6. Porting workflow

Six steps: inventory CUDA dependencies; use ROCm builds of PyTorch, vLLM or SGLang; port custom kernels with Triton or HIPIFY; validate numerics against the CUDA baseline; tune with profiling and larger memory per GPU; keep a CI matrix on both vendors with one manifest and two overlays.

6.1 Check the node and the framework

# GPUs visible to the driver, and their architecture (gfx target)
amd-smi list
rocminfo | grep -m1 -i "gfx"

# PyTorch on ROCm keeps the torch.cuda API, so most code is unchanged
python -c "import torch; print(torch.version.hip, torch.cuda.is_available(), torch.cuda.get_device_name(0))"

6.2 Serve a model in a ROCm container

# AMD publishes ROCm images for PyTorch and vLLM; pick a tag matching your ROCm version
docker run --rm -it --ipc=host \
  --device=/dev/kfd --device=/dev/dri --group-add video \
  --security-opt seccomp=unconfined \
  -p 8000:8000 -v ~/.cache/huggingface:/root/.cache/huggingface \
  rocm/vllm:<tag> \
  vllm serve <model> --tensor-parallel-size 2

The OpenAI-compatible endpoint is identical to the one vLLM exposes on NVIDIA, so clients, gateways and tests do not change.

6.3 Custom kernels

# Mechanical CUDA → HIP translation, then build with the ROCm compiler
hipify-perl my_kernel.cu > my_kernel.hip.cpp      # or hipify-clang for a full parse
hipcc -O3 --offload-arch=<gfx-target> -o my_kernel my_kernel.hip.cpp

Translation is the easy part. Warp-size assumptions (AMD's CDNA wavefronts are 64 lanes, NVIDIA warps 32), hand-tuned shared-memory layouts and inline PTX need review by hand. Where a kernel is being rewritten anyway, write it in Triton once and run it on both vendors.

6.4 Validate before you tune

Run a fixed evaluation set with the same weights and precision on both vendors. Compare task scores (and, for kernels, logits or outputs within a stated tolerance). Different hardware gives slightly different floating-point results; what matters is that model quality on your tasks is unchanged. Only then tune batch sizes, parallelism and serving parameters.

7. One Kubernetes platform, two vendors

Both vendors expose GPUs to Kubernetes through an operator and a device plugin: nvidia.com/gpu on NVIDIA nodes and amd.com/gpu on AMD nodes, with AMD's GPU Operator installing the driver components, device plugin, node labeller and a metrics exporter for Prometheus. Install it from AMD's Helm chart following the current ROCm GPU Operator documentation.

Keep one manifest per workload and a small overlay per vendor that changes only the image build (ROCm or CUDA) and the GPU resource. With Kustomize:

# overlays/amd/kustomization.yaml (Workstation example)
resources: ["../../base"]
images:
  - name: inference-server
    newName: registry.example.com/inference-server
    newTag: 2026.11-rocm
patches:
  - target: {kind: Deployment, name: inference-server}
    patch: |-
      - op: replace
        path: /spec/template/spec/containers/0/resources/limits
        value: {"amd.com/gpu": 8}
      - op: add
        path: /spec/template/spec/nodeSelector
        value: {"gpu-vendor": "amd"}

Label and taint each node pool by vendor and generation (for example gpu-vendor=amd, gpu-model=mi355x) so schedulers and cost reports can tell them apart, and run the same CI tests against both overlays on every change.

8. Benchmark fairly

  • Same model, same precision, same serving engine and version on both vendors, with each vendor's recommended build and settings.
  • Measure at your latency target, not peak throughput: time to first token and inter-token latency at the p95 your users need, then throughput at that point. vllm bench serve drives an OpenAI-compatible endpoint with realistic request mixes.
  • Use your traffic shape: prompt and output lengths, concurrency and the share of long-context requests.
  • Convert to tokens per pound: hardware or rental cost per hour, plus power at your tariff, divided by tokens per hour at the latency target.
  • Record accuracy on your evaluation set alongside speed.
  • Cross-check with independent results such as MLPerf Inference where both vendors submit comparable systems.

9. Decide per workload

Four questions in order: does the model fit on fewer GPUs with more memory; is there CUDA-only code you cannot port soon; which vendor wins on tokens per pound for your model and stack; can you get hardware, support and skills in time. Common outcome: both vendors on one Kubernetes platform.

WorkloadLeans AMD whenLeans NVIDIA when
LLM inference, large models or long contextMemory per GPU cuts replicas' GPU count; vLLM or SGLang servingYou depend on TensorRT-LLM or NVIDIA NIM microservices
Training and fine-tuning in PyTorchStandard PyTorch, FSDP or DeepSpeed; no custom CUDAHeavy custom kernels, Megatron-specific CUDA paths, tight deadlines
Vision, speech and classic MLFramework-level code, cost-sensitive inferenceLibraries with CUDA-only binaries (some video and 3D pipelines)
HPC and simulationFP64-heavy codes already ported to HIP; sovereign HPC programmesCUDA-only commercial solvers

10. Day-two operations

  • Pin versions together: driver, ROCm release, framework build and container tag form one tested set, exactly as with CUDA. Upgrade them as a set, behind the golden-set tests.
  • Monitor: amd-smi exposes utilisation, memory, power, temperature and error counters; AMD's device metrics exporter publishes them to Prometheus next to DCGM metrics from NVIDIA nodes. Normalise label names so one dashboard covers both.
  • Health and RAS: alert on ECC and RAS error counts, thermal throttling and links dropping speed, and drain nodes automatically on repeated errors.
  • Skills: train at least two engineers on ROCm tooling before production; most issues are version mismatches, which are quick to fix once someone knows where to look.
  • Supply: keep both vendors qualified so a lead-time problem on one does not stop a project.

11. Risks to weigh honestly

  • Ecosystem depth: CUDA still has more libraries, examples and people. Check every dependency, not just the framework.
  • Vendor claims: both companies publish favourable comparisons. Independent and in-house measurements decide.
  • Concentration: both vendors depend on the same leading-edge manufacturing in Taiwan, a point Su herself raised in the interview when she talked about supply-chain resilience. Dual-vendor reduces product risk, not geographic risk.
  • Market momentum cuts both ways: AMD's large customer commitments make ROCm investment durable, but also compete with smaller buyers for early supply.

12. How Workstation can help

We design and run GPU infrastructure in the UK and help teams evaluate AMD alongside NVIDIA. For teams weighing Instinct we can run a like-for-like benchmark of your model on both vendors, assess your code for CUDA dependencies, set up a dual-vendor Kubernetes platform with shared monitoring, and size servers, power and cooling. Start with our GPU private cloud guide, compare leasing and buying at gpuleasing.co.uk, or talk to us.

Sources

  • Bloomberg Originals, "AMD's CEO Wants to Chip Away at Nvidia's Lead | The Circuit with Emily Chang", 6 December 2024. Quotes are from the published video.
  • AMD, "AMD Reports Third Quarter 2026 Financial Results", 3 November 2026 (revenue, Data Center growth, Helios customers, ROCm 10, LUMI-AI, Q4 outlook).
  • AMD, Helios rack-scale solution and Instinct MI400 Series product pages, and "AMD Launches Helios" (2026): rack and GPU specifications and AMD's comparison with Vera Rubin NVL72.
  • AMD and OpenAI agreement for 6 gigawatts of Instinct GPUs, announced 6 October 2025.
  • Memory arithmetic and porting commands are Workstation examples; check model configurations and current ROCm documentation before relying on them.

Acknowledgement of rights: AMD, the AMD Arrow logo, Instinct, EPYC, Ryzen, Threadripper, CDNA, ROCm, Pensando, Helios and combinations thereof are trademarks of Advanced Micro Devices, Inc. NVIDIA, CUDA, NVLink, TensorRT, Spectrum-X, ConnectX and Vera Rubin are trademarks of NVIDIA Corporation. Bloomberg is a trademark of Bloomberg Finance L.P. Other names are the property of their respective owners. This article is independent and not endorsed by any of these companies.

شارك هذا المقال

المزيد في Technology

Private AI for Financial Data: Residency, Routing and Cost on AWS Bedrock, Microsoft Azure and Your Own GPUs

Private AI for Financial Data: Residency, Routing and Cost on AWS Bedrock, Microsoft Azure and Your Own GPUs

Billing models and idle cost, per-call cost at three volumes, Bedrock in-region vs EU profiles, Converse API with prompt caching and IAM region enforcement, Azure deployment types and Claude on Foundry, UK and EU providers, a residency-aware provider registry, cost-cutting workflow, a golden-set evaluation harness and GPU break-even

اقرأ المزيد
NVKE and NVKR Technote: Building a Managed GPU Kubernetes Service from Bare Metal, with Reproducible, Verifiable Builds

NVKE and NVKR Technote: Building a Managed GPU Kubernetes Service from Bare Metal, with Reproducible, Verifiable Builds

Architecture, components and pinned versions, the NVKR Definition-Run-Release-Verify lifecycle, the full nvkectl workflow from racked servers to a customer cluster, node attestation, day-two operations, every preview limitation with a mitigation, a comparison with other approaches and a staged evaluation plan

اقرأ المزيد
AI Is a Five-Layer Cake: What AI Is, How It Works and Why Every Layer Matters

AI Is a Five-Layer Cake: What AI Is, How It Works and Why Every Layer Matters

Jensen Huang's framework explained: energy, chips, infrastructure, models and applications, how each layer depends on the ones below, and what it means for your business.

اقرأ المزيد